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| ECG-12.288M EC G Series Resistance Welded HC-49/U Crystal Frequency Tolerance/Stability 15ppm at 25C, 30ppm over -20C to +70C Mode of Operation AT-Cut Fundamental -12.288M Nominal Frequency 12.288MHz Load Capacitance 18pF Parallel Resonant ELECTRICAL SPECIFICATIONS Nominal Frequency Frequency Tolerance/Stability Aging at 25C Load Capacitance Shunt Capacitance (C0) Equivalent Series Resistance Mode of Operation Drive Level Storage Temperature Range Insulation Resistance 12.288MHz 15ppm at 25C, 30ppm over -20C to +70C 5ppm/year Maximum 18pF Parallel Resonant 7pF Maximum 30 Ohms Maximum AT-Cut Fundamental 2mWatts Maximum -40C to +85C 500 Megaohms Minimum at 100Vdc ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test Gross Leak Test Lead Integrity Mechanical Shock Resistance to Soldering Heat Resistance to Solvents Solderability Temperature Cycling Vibration MIL-STD-883, Method 1014, Condition A MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 2004 MIL-STD-202, Method 213, Condition C MIL-STD-202, Method 210 MIL-STD-202, Method 215 MIL-STD-883, Method 2003 MIL-STD-883, Method 1010 MIL-STD-883, Method 2007, Condition A MECHANICAL DIMENSIONS (all dimensions in millimeters) LINE MARKING 1 2 ECLIPTEK E12.288M E=Ecliptek Designator or Blank (No Marking) XX XX=Ecliptek Manufacturing Code 12.70 MIN DIA 0.457 0.051(X2) 11.18 MAX 4.88 0.20 13.58 MAX 4.70 MAX 3 www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 1 of 3 ECG-12.288M Recommended Solder Reflow Methods TP Critical Zone TL to T P Ramp-up Ramp-down Temperature (T) TL TS Max TS Min t S Preheat t 25C to Peak tL tP Time (t) High Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 2 of 3 ECG-12.288M Recommended Solder Reflow Methods TP Critical Zone TL to T P Ramp-up Ramp-down Temperature (T) TL TS Max TS Min t S Preheat t 25C to Peak tL tP Time (t) Low Temperature Solder Bath (Wave Solder) TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 30 - 60 Seconds 5C/second Maximum 150C 200 Seconds Maximum 245C Maximum 245C Maximum 1 Time / 235C Maximum 2 Times 5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev P 2/16/2010 | Page 3 of 3 |
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